SPECIAL ISSUE | 特刊推荐

Special Issue on Artificial Intelligence in Cyber-Physical Systems

Aim & Scope: Artificial Intelligence (AI) approaches have recently received much attention as a key enabler for next-generation Cyber-Physical Systems (CPS). CPS monitor and control physical elements with computer-based algorithms, and are capable of autonomously react to and affect their physical surroundings. For example, connected vehicles communicate with their neighboring cars or infrastructures in future vehicular-to-everything (V2X) networks, and autonomous robots control their surroundings in industrial Internet of things (IIoT). AI techniques, including machine learning, deep learning, and reinforcement learning approaches, can leverage big data analytics to enhance situational awareness and to provide smart capabilities such as self-configuration, self-optimization and self-diagnosis. In the future, AI in CPS would include health and biomedical monitoring, robotics systems, intelligent edge devices, among many other functions, and be used to correct natural disasters, human errors, or malicious actions, etc.

This special issue invites researchers and practitioners to submit papers describing recent advances and challenges in artificial intelligence, cyber-physical systems, and their integrations, and in particular to solicit contributions on real-world applications. Topics include, but are not limited to, the following:
Network architectures and communication protocols for AI in CPS 
Modeling and performance analysis of AI-based CPS networks
Network optimization to enhance AI-based CPS performance
Autonomous Cyber-Physical Systems
Implementing AI techniques on wireless CPS networks
AI-based techniques for CPS security 
AI-based techniques for fault diagnosis in CPS services 
AI-based techniques for CPS security and services 
AI techniques for emerging CPS applications, e.g., robotics, edge intelligence, smart healthcare, etc.

Guest Editors:
Dr. Haoyuan Pan, Shenzhen University, China
Dr. Ming Tang, The University of British Columbia, Canada
Dr. Tse-Tin Chan, The Hang Seng University of Hong Kong, Hong Kong, China
Dr. Jiaxin Liang, The Chinese University of Hong Kong, Hong Kong, China

Submission Deadline: March 1st, 2021

Paper Template: Templates (Word or LaTex) are available here

Submission Link: https://www.inderscience.com/mobile/journal/insubmithere.php?jcode=ijssc

Submission Instructions

Note: Please remark "ICAII 2021" when you submit your paper